Huizhou Xinghongtai Electronics Co., Ltd.

Huizhou Xinghongtai Electronics Co., Ltd.

Manufacturer from China
Verified Supplier
1 Years
Home / Products / Metal Core PCB Manufacturing /

Industrial Aluminum Base Round Led Metal Core PCB Circuit Board Fabrication Customized Design

Contact Now
Huizhou Xinghongtai Electronics Co., Ltd.
Visit Website
City:huizhou
Province/State:guangdong
Country/Region:china
Contact Person:MissJane Wu
Contact Now

Industrial Aluminum Base Round Led Metal Core PCB Circuit Board Fabrication Customized Design

Ask Latest Price
Video Channel
Brand Name :XHT
Model Number :XHT-Metal Core PCB Manufacturing-5
Certification :ISO、IATF16949、RoSH
Place of Origin :China
MOQ :Low MOQ
Payment Terms :T/T, Western Union, MoneyGram
Supply Ability :100000pcs/day
Delivery Time :5-8 day
Board Thickness :0.2mm-6.0mm
Min. Line Width/Spacing :0.1mm/0.1mm
Solder Mask Color :Green, Black, White, Blue, Red
Silkscreen Color :White, Black, Yellow
Min. Hole Size :0.2mm
Dielectric Constant :2.5-4.5
Min. Silkscreen Bridge :0.1mm
Material :Metal Core
Min. Solder Mask Bridge :0.1mm
Layer Count :1-4 Layers
Operating Temperature :-40°C to 150°C
Thermal Conductivity :1.0-8.0 W/mK
Copper Thickness :1oz-6oz
Surface Finish :HASL, ENIG, OSP, Immersion Silver, Immersion Tin
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

Aluminum Base Round Led Pcb Board Custom Aluminum Circuit Board

PCB manufacturer in china

we produced lots of metal core pcbs in our manufacturing factory, include aluminum and copper core pcbs.

Our company has first-class PCB manufacturing capabilities and provides customers with high-quality, high-performance printed circuit boards. We have advanced production equipment and technical teams to meet customers’ needs for various complex PCBs.

First, we have advanced production equipment. Our factory is equipped with the latest PCB production lines, these devices can accurately realize customers’ PCB design requirements and ensure product quality and stability.

Secondly, we have a professional technical team. Our team of engineers has extensive experience in PCB design and manufacturing and is able to provide customers with a full range of technical support. Whether in the PCB design stage or during the manufacturing process, we are able to provide customers with professional advice and solutions to ensure that the product can achieve optimal performance and reliability.

In addition, we also focus on quality management. We strictly follow international quality management system standards to ensure that every PCB meets customer requirements and standards. We use advanced testing equipment and strict quality control processes to conduct comprehensive testing and verification of each PCB to ensure product quality and stability.

Finally, we are able to meet our customers’ needs for various complex PCBs. Whether it is a single-layer, double-layer or multi-layer PCB, whether it is a rigid, flexible or rigid-flexible PCB, we are able to provide customers with high-quality customized solutions. We can also meet customers’ PCB manufacturing needs for special process requirements, such as blind and buried vias, controlled impedance, special materials, etc.

In short, we have strong PCB manufacturing capabilities and are able to provide customers with high-quality, high-performance printed circuit boards. We will continue to invest more resources and energy to continuously improve our manufacturing capabilities and provide customers with better products and services.

XHT PCB Process Capability

Process Item Process Capability
Base Information Production Capability Layer count 1-30 layers
Bow and twist 0.75% standard, 0.5% advanced
Min. finished PCB size 10 x 10mm(0.4 x 0.4")
Max. finished PCB size 530 x 1000mm(20.9 x 47.24 ")
Multi-press for blind/buried vias Multi-press Cycle≤3 times
Finished board thickness 0.3 ~ 7.0mm(8 ~ 276mil)
Finished board thickness tolerance +/-10% standard, +/-0.1mm advanced
Surface finish HASL, Lead free HASL, Flash gold, ENIG, Hard gold plating, OSP, Immersion Tin, Immersion silver, etc
Selective surface finish ENIG+Gold finger, Flash gold+Gold finger
Material Type FR4, Aluminum, CEM, Rogers, PTFE, Nelco, Polyimide/Polyester, etc. Also can buy the materials as request
Copper foil 1/3oz ~ 10oz
Prepreg Type FR4 Prepreg, LD-1080(HDI) 106, 1080, 2116, 7628, etc..
Reliable Test Peel strength 7.8N/cm
Fammability 94V-0
Ionic contamination ≤1ug/cm²
Min. dielectric thickness 0.075mm(3mil)
Impedance tolerance +/-10%, min can control +/- 7%
Inner layer&Outer layer Image Transfer Machine Capability Scrubbing Machine Material thickness: 0.11 ~ 3.2mm(4.33mil ~ 126mil)
Material size: min. 228 x 228mm(9 x 9")
Laminator, Exposer Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil)
Material size: min 203 x 203mm(8 x 8"), max. 609.6 x 1200mm(24 x 30 ")
Etching Line Material thickness: 0.11 ~ 6.0mm(4.33mil ~ 236mil)
Material size: min. 177 x 177mm(7 x 7")
Inner layer Process Capability Min. inner line width/spacing 0.075/0.075mm(3/3mil)
Min. spacing from hole edge to conductive 0.2mm(8mil)
Min. inner layer annular ring 0.1mm(4mil)
Min. inner layer isolation clearance 0.25mm(10mil) standard, 0.2mm(8mil) advanced
Min. spacing from board edge to conductive 0.2mm(8mil)
Min. gap width between copper ground 0.127mm(5mil)
Unbalance copper thickness for inner core H/1oz, 1/2oz
Max. finished copper thickness 10oz
Outer layer Process Capability Min. outer line width/spacing 0.075/0.075mm(3/3mil)
Min. hole pad size 0.3mm(12mil)
Process Capability Max. slot tenting size 5 x 3mm(196.8 x 118mil)
Max. tenting hole size 4.5mm(177.2mil)
Min. tenting land width 0.2mm(8mil)
Min. annular ring 0.1mm(4mil)
Min. BGA pitch 0.5mm(20mil)
AOI Machine Capability Orbotech SK-75 AOI Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil)
Material size: max. 597 ~ 597mm(23.5 x 23.5")
Orbotech Ves Machine Material thickness: 0.05 ~ 6.0mm(2 ~ 236.2mil)
Material size: max. 597 ~ 597mm(23.5 x 23.5")
Drilling Machine Capability MT-CNC2600 Drill machine Material thickness: 0.11 ~ 6.0mm(4.33 ~ 236mil)
Material size: max. 470 ~ 660mm(18.5 x 26")
Min. drill size: 0.2mm(8mil)
Process Capability Min. multi-hit drill bit size 0.55mm(21.6mil)
Max. aspect ratio(finished board size VS Drill size) 12:01
Hole location tolerance(compared with CAD) +/-3mil
Counterbore hole PTH&NPTH, Top angle 130°,Top diameter <6.3mm
Min. spacing from hole edge to conductive 0.2mm(8mil)
Max. drill bit size 6.5mm(256mil)
Min. multi-hit slot size 0.45mm(17.7mil)
Hole size tolerance for press fit +/-0.05mm(+/-2mil)
Min. PTH slot size tolerance +/-0.15mm(+/-6mil)
Min. NPTH slot size tolerance +/-2mm(+/-78.7mil)
Min. spacing from hole edge to conductive(Blind vias) 0.23mm(9mil)
Min. laser drill size 0.1mm(+/-4mil)
Countersink hole angle&Diameter Top 82,90,120°
Wet Process Machine Capability Panel&Pattern plating line Material thickness: 0.2 ~ 7.0mm(8 ~276mil)
Material size: max. 610 x 762mm(24 x 30")
Deburring Maching Material thickness: 0.2 ~ 7.0mm(8 ~276mil)
Material size: min. 203 x 203mm(8" x 8")
Desmear Line Material thickness: 0.2mm ~ 7.0mm(8 ~276mil)
Material size: max. 610 x 762mm(24 x 30")
Tin plating line Material thickness: 0.2 ~ 3.2mm(8 ~126mil)
Material size: max. 610 x 762mm(24 x 30")
Process Capability Hole wall copper thickness average 25um(1mil) standard
Finished copper thickness ≥18um(0.7mil)
Min line width for etching marking 0.2mm(8mil))
Max.finished copper weight for inner&outer layers 7oz
Different copper thickness H/1oz,1/2oz
Solder Mask& Silkscreen Machine Capability Scrubbing Machine Material thickness: 0.5 ~ 7.0mm(20 ~ 276mil)
Material size: min. 228 x 228mm(9 x 9")
Exposer Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil)
Material size: max. 635 x 813mm(25 x 32")
Develop machine Material thickness: 0.11 ~ 7.0mm(4.3 ~ 276mil)
Material size: min. 101 x 127mm(4 x 5")
Color Solder mask color Green, matte green, yellow, black, blue, red, white
Silkscreen color White, yellow, black, blue
Solder Mask Capability Min. solder mask opening 0.05mm(2mil)
Max. plugged via size 0.65mm(25.6mil)
Min. width for line coverage by S/M 0.05mm(2mil)
Min. solder mask legends width 0.2mm(8mil) standard, 0.17mm(7mil) advanced
Min. solder mask thickness 10um(0.4mil)
Solder mask thickness for via tenting 10um(0.4mil)
Min. carbon oil line width/spacing 0.25/0.35mm(10/14mil)
Min. tracer of carbon 0.06mm(2.5mil)
Min. carbon oil line trace 0.3mm(12mil))
Min. spacing from carbon pattern to pads 0.25mm(10mil)
Min. width for peelable mask cover line/pad 0.15mm(6mil)
Min. solder mask bridge width 0.1mm(4mil))
Solder mask Hardness 6H
Peelable Mask Capability Min. spacing from peelable mask pattern to pad 0.3mm(12mil))
Max. size for peelable mask tent hole(By screen printing) 2mm(7.8mil)
Max. size for peelable mask tent hole(By aluminum printing) 4.5mm
Peelable mask thickness 0.2 ~ 0.5mm(8 ~20mil)
Silkscreen Capability Min. silkscreen line width 0.11mm(4.5mil)
Min. silkscreen line height 0.58mm(23mil)
Min. spacing from legend to pad 0.17mm(7mil)
Surface Finish Surface Finish Capability Max. gold finger length 50mm(2")
ENIG 3 ~ 5um(0.11 ~ 197mil) nickel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) gold
gold finger 3 ~ 5um(0.11 ~ 197mil) nickel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) gold
HASL 0.4um(0.016mil) Sn/Pb
HASL Machine Material thickness: 0.6 ~ 4.0mm(23.6 ~ 157mil)
Material size: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25")
Hard gold plating 1-5u"
Immersion Tin 0.8 ~ 1.5um(0.03 ~ 0.059mil) Tin
Immersion Silver 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag
OSP 0.2 ~ 0.5um(0.008 ~ 0.02mil)
E-Test Machine Capability Flying probe tester Material thickness: 0.4 ~ 6.0mm(15.7 ~ 236mil)
Material size: max. 498 x 597mm(19.6 ~ 23.5")
Min. spacing from test pad to board edge 0.5mm(20mil)
Min. conductive resistance
Max. insulation resistance 250mΩ
Max. test voltage 500V
Min. test pad size 0.15mm(6mil))
Min. test pad to pad spacing 0.25mm(10mil)
Max. test current 200mA
Profiling Machine Capability Profiling type NC routing, V-cut, slot tabs, stamp hole
NC routing machine Material thickness: 0.05 ~ 7.0mm(2 ~ 276mil)
Material size: max. 546 x 648mm(21.5 x 25.5")
V-cut machine Material thickness: 0.6 ~ 3.0mm(23.6 ~ 118mil)
Max material width for V-cut: 457mm(18")
Process Capability Min. routing bit size 0.6mm(23.6mil)
Min. outline tolerance +/-0.1mm(+/-4mil)
V-cut angle type 20°, 30°, 45°, 60°
V-cut angle tolerance +/-5°
V-cut registration tolerance +/-0.1mm(+/-4mil )
Min. gold finger spacing +/-0.15mm(+/-6mil)
Bevelling angle tolerance +/-5°
Bevelling remain thickness tolerance +/-0.127mm(+/-5mil)
Min. inner radius 0.4mm(15.7mil)
Min. spacing from conductive to outline 0.2mm(8mil)
Countersink/Counterbore depth tolerance +/-0.1mm(+/-4mil)

Q1:Are you a factory or trade company?

A: Yes, we are the factory, we have our own PCB manufacturing & Assembly factory.

Q2:What kind of PCB file format can you accept for production?

A:Gerber, PROTEL 99SE, PROTEL DXP, POWER PCB, CAM350, GCCAM, ODB+(.TGZ)

Q3:Are my PCB files safe when I submit them to you for manufacturing?

A:We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written. Permission from you, nor we'll share these files with any other 3rd parties.

Q4:No PCB file/Gbr file, only have the PCB sample,can you produce it for me?

A: Yes,we could help you to clone the PCB. Just send the sample PCB to us, we could clone the PCB design and work out it.

Q5:What is Chuante lead time?

A:Sample: 1-2 Layers: 5 to 7working days 4-8 Layers: 12 working days Mass production: 1-2 Layers:7 to 15 working days 4-8 Layers:10 to 18 working days The leadtime is depends on your final confirmed quantity.

Q6:What payment do you accept ?

A:-Wire Transfer(T/T) -Western Union -Paypal -Ali Pay

Q7:How to get the PCBs?

A:For small packages, we will ship the boards to you by DHL,UPS,FedEx. Door to door service! You will get your PCBs at your home. For heavy goods more than 300kg, we may ship your PC boards by ship or by air to save freight cost. Of course, if you have your own forwarder, we may contact them for dealing with your shipment.

Q8:What is your minimum order quantity?

A: No MOQ.

Custom Aluminum Circuit Board Manufacturer

Introduction

Our company established in 2004, has become a trusted name in the EMS industry, strategically located in Huizhou, Guangdong province, near the bustling hub of Shenzhen.
With a landscape of 20,000 square meters, our facilities are equipped to cater to a diverse range of customers across various sectors, from consumer electronics to medical devices, automotive components, industrial equipment, power systems, new energy solutions, and communication devices.
Our comprehensive EMS/ODM/OEM services, including electronic system design, prototype development, PCB manufacturing, assembly, and rigorous testing, ensure top-notch quality, competitive pricing, and punctual delivery.

We have a strong electronic component supply chain, we can offer competitive price for your BOM list.

we've implemented a complete MES (Manufacturing Execution System) covering raw material acceptance, SMT surface mounting, DIP plug-in, and stringent product functional testing.
This system allows real-time monitoring and data tracing of any abnormal conditions during production, ensuring product integrity and full process traceability.
Our monthly production capacity of 600 million points ensures top-notch quality and timely delivery.

Service

We specialize in providing comprehensive EMS solutions to meet the unique needs of our clients.

Here's a glimpse of the services we offer:
1.Electronic Components Supply.
2.PCB Manufacturing.
3.PCB Assembly.
4.Box Building.
We have a strong electronic component supply chain, we can offer competitive price for your BOM list.
Industrial Aluminum Base Round Led Metal Core PCB Circuit Board Fabrication Customized DesignIndustrial Aluminum Base Round Led Metal Core PCB Circuit Board Fabrication Customized DesignIndustrial Aluminum Base Round Led Metal Core PCB Circuit Board Fabrication Customized DesignIndustrial Aluminum Base Round Led Metal Core PCB Circuit Board Fabrication Customized DesignIndustrial Aluminum Base Round Led Metal Core PCB Circuit Board Fabrication Customized Design
Inquiry Cart 0