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The High Frequency PCB Manufacturing product features a minimum trace/space of 4/4mil, enabling high-density and high-speed signal transmission. It also supports blind and buried vias, which are critical for multi-layered PCB designs. The product's advanced manufacturing process ensures the vias are accurately drilled and precisely aligned, reducing signal loss and improving signal integrity.
The High Frequency PCB Manufacturing product has a lead time of 3-5 days for prototype and 7-10 days for mass production, making it an efficient solution for time-sensitive projects. Its quick turnaround time enables engineers to quickly test and iterate their designs, reducing development time and cost.
This product is ideal for creating high-frequency circuit boards, microwave PCB, and high-speed PCB.
Product Name | Custom Electric Circuit Board High Frequency Pcb Fr4 Pcb Manufacturer |
Application | High-Frequency Electronics |
Maximum Panel Size | 600x1200mm |
Solder Mask Color | Green, Blue, Black, Red, Yellow, White |
Blind And Buried Vias | Available |
Quality Standard | IPC Class 2, Class 3 |
Material | High Frequency Laminate |
Copper Thickness | 0.5-6.0oz |
Minimum Hole Size | 0.2mm |
Surface Finish | HASL, ENIG, Immersion Silver, OSP |
Silkscreen Color | White, Black, Yellow |
Lead Time | 3-5 Days For Prototype, 7-10 Days For Mass Production |
High Frequency PCB Design Consideration:
1. Using the middle inner plane as the power and ground layers can provide shielding, reduce parasitic inductance, shorten signal line length, and minimize cross interference between signals.
2. The wiring must be bent at a 45 degree angle to reduce the transmission of high-frequency signals and the coupling between them.
3. The shorter the length of the wiring, the better, and the shorter the parallel distance between two wires, the better.
4. The fewer through holes, the better.
5. The direction of interlayer wiring should be vertical, with the top layer being horizontal and the bottom layer being vertical, in order to reduce interference between signals.
6. Adding grounding copper can reduce interference between signals.
7. Ground wrapping of important signal lines can significantly improve the anti-interference ability of the signal. Of course, ground wrapping of interference sources can also be used to prevent them from interfering with other signals.
The XHT-HFPCB is suitable for a wide range of high-speed PCB applications. Its high-frequency capabilities make it ideal for use in the telecommunications, medical, aerospace, and military industries. The XHT-HFPCB is an excellent choice for applications that require high signal integrity, low loss, and low noise.
The XHT-HFPCB is available in a variety of board thicknesses ranging from 0.2mm to 6.0mm and layer counts from 1 to 20 layers. It also features blind and buried vias, which are essential for high-density designs. The XHT-HFPCB uses high-frequency laminate material, which provides excellent electrical performance and reliability.
The XHT-HFPCB is suitable for various scenarios, including high-speed data transfer, high-frequency signal processing, and high-frequency signal transmission. It can also be used in applications that require high power handling and thermal management.
With a supply ability of 100,000 pieces per day, XHT-HFPCB can meet the needs of large-scale projects. The lead time for prototype production is only 3-5 days, while mass production takes 7-10 days.
Payment options for XHT-HFPCB include T/T, Western Union, and MoneyGram. This product is an excellent choice for customers looking for a reliable and high-quality high-frequency circuit board with a quick turnaround time and low MOQ requirement.
XHT offers product customization services for our High-Frequency Circuit Board (HFPCB) model XHT-HFPCB. Our HFPCBs are made from high-frequency laminate material and have impedance control up to IPC Class 2 and Class 3 quality standards. Our products are also certified by ISO, IATF16949, and RoHS, ensuring our commitment to quality and reliability.
Our customers can order our HFPCBs with low MOQ and expect a fast delivery time of 5-8 days. We accept various payment terms such as T/T, Western Union, and MoneyGram. With our daily supply ability of up to 100000pcs, we can cater to all your needs for high-frequency circuit board, microwave PCB.
Our HFPCBs have a maximum panel size of 600x1200mm, and we offer blind and buried vias to enhance your design flexibility. Our products are manufactured in China, and we guarantee top-notch quality and performance.
Our High Frequency PCB Manufacturing product comes with comprehensive technical support and services to ensure that our customers get the best possible performance from their products. Our team of expert engineers is available to provide technical assistance and advice on any issues that may arise during the manufacturing process.
We offer a range of services to help our customers get the most out of their High Frequency PCBs, including design review, prototyping, testing, and optimization. Our state-of-the-art testing facilities and equipment ensure that every High Frequency PCB we produce meets the highest standards of quality and performance.
In addition to our technical support and services, we also offer training and educational resources to help our customers develop their skills and expertise in High Frequency PCB manufacturing. Our goal is to provide our customers with the tools and knowledge they need to be successful in this highly specialized field.